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Lee, H. et al. (n.d.). Back Cover: Layer‐by‐Layer‐Based Silica Encapsulation of Individual Yeast with Thickness Control (Chem. Asian J. 1/2015). Chemistry, an Asian journal. 10 (1), p. 264. [Online].
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Lee, H. et al. (n.d.). Back Cover: Layer‐by‐Layer‐Based Silica Encapsulation of Individual Yeast with Thickness Control (Chem. Asian J. 1/2015). Chemistry, an Asian journal. 10 (1), p. 264. [Online].