Cite
APA Citation
Stein, J., Welzel, U., Huegel, W., Blatt, S., & Mittemeijer, E. J. (n.d.). aging‐time‐resolved in situ microstructural investigation of tin films electroplated on copper substrates, applying two‐dimensional‐detector X‐ray diffraction. Journal of applied crystallography, 46, 1645–1653. http://access.bl.uk/ark:/81055/vdc_100024580960.0x00004f