Cite
MLA Citation
Shenglin Ma and Yufeng Jin. TSV 3D RF integration : high resistivity Si interposer technology. Amsterdam : Elsevier, 2022. http://access.bl.uk/ark:/81055/vdc_100152285285.0x000001
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Shenglin Ma and Yufeng Jin. TSV 3D RF integration : high resistivity Si interposer technology. Amsterdam : Elsevier, 2022. http://access.bl.uk/ark:/81055/vdc_100152285285.0x000001