Cite
APA Citation
Suhir, E. (2020). Avoiding inelastic strains in solder joint interconnections of IC devices. Boca Raton : CRC Press. http://access.bl.uk/ark:/81055/vdc_100112463687.0x000001
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Suhir, E. (2020). Avoiding inelastic strains in solder joint interconnections of IC devices. Boca Raton : CRC Press. http://access.bl.uk/ark:/81055/vdc_100112463687.0x000001