Avoiding inelastic strains in solder joint interconnections of IC devices. (2020)

• Record Type: Book
• Further Information: Note: Ephraim Suhir.
• Authors: Suhir, Ephraim
• Contents: 1. Analytical Modeling. 2. Method of Interfacial Compliance. 3. Thermal Stress in Assemblies with Identical Adherends. 4. Inelastic Strains. 5. Elevated Stand-Off Heights Can Relieve Thermal Stress in Solder Joints. 6. Stress Relief in Assemblies with Inhomogeneous Bonds. 7. Relieving Thermal Stress in Flip-Chip Design. 8. Board Level Dynamic Tests. 9. Accelerated Testing: HALT and FOAT. 10. Probabilistic Design for Reliability of Solder Joint Interconnections. 11. Thermal Stress in Optical Fibers
• Edition: 1st
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2020
• Extent: 1 online resource, illustrations (black and white)
• Subjects: 621.3815; Interconnects (Integrated circuit technology) -- Protection; Solder and soldering -- Mechanical properties -- Mathematical models; Failure analysis (Engineering)
• Languages: English
• ISBNs: 9780429863813; 9780429863820; 9780429863806; 9780429460470
• Related ISBNs: 9781138624733
• Notes: Note: Includes bibliographical references and index.; Note: Description based on CIP data; resource not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.