Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10 Part 10, (30th November 1977)

• Record Type: Book
• Authors: British Standards Institution,
• Publisher Details: London : British Standards Institution
• Publication Date: 1977
• Extent: 1 online resource (16 pages)
• Subjects: 602.1841; Electrical resistivity; Metal coatings; Dissipation factor; Packaging; Flammability; Weight (mass); Printed-circuit bases; Test equipment; Adhesion tests; Dimensional measurement; Copper; Thickness measurement; Fatigue testing; Electrical resistance; Mechanical testing; Dimensional changes; Density; Printed-circuit boards; Tensile strength; Films (states of matter); Thickness; Flexible materials; Adhesive strength; Tensile testing; Permittivity; Laminates; Fire tests; Fatigue; Bend testing; Weight measurement; Elongation at fracture; Density measurement; Surface properties; Defects; Polymers; Coated materials; Printed circuits; Dimensions; Foil; Marking; Dimensional tolerances; Soldering; Electronic equipment and components; Dielectric strength
• Languages: English
• Related ISBNs: 0580095576
• ISSNs: 1008-9630
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.