1. Printed boards and assemblies. Design and use. Generic requirements. Generic requirements. Controlled impedance Part 1-2, (15th December 1998) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (38 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Specification for epoxide resin casting systems for electrical applications. (18th November 1964) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (17 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10 Part 10, (30th November 1977) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (16 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Specification for metal-clad base materials for printed circuits. Bonding sheet material for use in the fabrication of multilayer printed boards: EP-GC-11 Part 11, (30th December 1977) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (13 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Specification for phenolic resin bonded paper laminated sheets for electrical applications. (30th April 1980) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (37 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Specification for metal-clad base materials for printed circuits. Phenolic cellulose paper copper-clad laminated sheet of high electrical quality, flame retardant grade: PF-CP-Cu-8 Part 8, (28th July 1972) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (12 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Specification for metal-clad base materials for printed circuits. Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3 Part 3, (28th July 1972) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (18 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9 Part 9, (30th April 1979) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (17 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Specification for metal-clad base materials for printed circuits. Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards: EP-GC-Cu-12 Part 12, (30th September 1982) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (12 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Specification for metal-clad base materials for printed circuits. Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2 Part 2, (1st September 1982) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (15 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗