1. BS EN 60384-19. Fixed capacitors for use in electronic equipment. Part 19. Sectional specification: Fixed metallized polyethylene terephthalate film dielectric surface mount DC capacitors (12th February 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (37 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering Part 3, (18th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (34 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Circuit boards and circuit board assemblies. Design and use. Land pattern design. Description of land pattern for the most common surface mounted components (SMD) Part 6-2, (19th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (32 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Circuit boards and circuit board assemblies. Design and use. Land pattern design. Generic requirements for land pattern on circuit boards Part 6-1, (7th April 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (36 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies Part 4, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (20 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies Part 3, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (18 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Specification for soft solders. (31st January 1977) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (11 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Specification for phosphoric acid based flux for soft soldered joints in stainless steel. (30th September 1975) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies Part 2, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (26 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10 Part 10, (30th November 1977) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (16 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗