Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies Part 3, (15th January 1999)

• Record Type: Book
• Authors: British Standards Institution,
• Publisher Details: London : British Standards Institution
• Publication Date: 1999
• Extent: 1 online resource (18 pages)
• Subjects: 602.1841; Defects; Semiconductor devices; Electrical equipment; Electronic equipment and components; Electrical components; Holes; Integrated circuits; Printed circuits; Boards; Surface properties; Wires; Microassembling; Joints; Printed-circuit boards; Soldering
• Languages: English
• Related ISBNs: 0580308405
• ISSNs: 0155-5728
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.