1. Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering Part 3, (18th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (34 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies Part 4, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (20 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies Part 3, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (18 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies Part 2, (15th January 1999) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (26 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies Part 2, (7th October 2019) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (40 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗