Cite
APA Citation
Keser, B., & Kroehnert, S. (Eds.) (2019). Advances in embedded and fan-out wafer level packaging technologies. Hoboken : Wiley-IEEE Press. http://access.bl.uk/ark:/81055/vdc_100076715000.0x000001
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Keser, B., & Kroehnert, S. (Eds.) (2019). Advances in embedded and fan-out wafer level packaging technologies. Hoboken : Wiley-IEEE Press. http://access.bl.uk/ark:/81055/vdc_100076715000.0x000001