Cite
MLA Citation
Shichun Qu and Yong Liu. Wafer-level chip-scale packaging : analog and power semiconductor applications. New York : Springer, 2015. http://access.bl.uk/ark:/81055/vdc_100069715246.0x000001
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Shichun Qu and Yong Liu. Wafer-level chip-scale packaging : analog and power semiconductor applications. New York : Springer, 2015. http://access.bl.uk/ark:/81055/vdc_100069715246.0x000001