Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications Part 1-3, (28th March 2018)

Record Type:: Book
Title:: Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications Part 1-3, (28th March 2018)
Main Title:: Attachment materials for electronic assembly.
Authors:: British Standards Institution,
Issue Display:: Part 1
Part:: 1
Issue Sort Value:: 0000-0000-0000-0001
Publisher Details:: London : British Standards Institution
Publication Date:: 2018
Extent:: 1 online resource (50 pages)
Subjects:: 602.1841
Electrical connections
Solders
Pastes
Test methods
Quality assurance
Bonding
Particulate materials
Fluxes (materials)
Soldering
Classification systems
Bars (materials)
Quality control
Electronic engineering
Electronic equipment and components
Languages:: English
Related ISBNs:: 9780580892387
ISSNs:: 3031-8682
Access Rights:: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD.DS.744390
Ingest File:: 15_030.xml