51. A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. (August 2018) Authors: Niu, Yuling; Wang, Jing; Shao, Shuai; Wang, Huayan; Lee, Hohyung; Park, S.B. Journal: Microelectronics and reliability Issue: Volume 87(2018) Page Start: 81 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
52. A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow. (September 2020) Authors: Wang, Jing; Niu, Yuling; Shao, Shuai; Wang, Huayan; Xu, Jiefeng; Pham, Vanlai; Park, Seungbae Journal: Microelectronics and reliability Issue: Volume 112(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
53. A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing. (September 2019) Authors: Mane, Sanjay Shrirang; Sethu, Raj Sekar; Bergmann, Lars; Erstling, Marco; Soon, Kok Heng Journal: Microelectronics and reliability Issue: Volume 100/101(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
54. A concise study of neutron irradiation effects on power MOSFETs and IGBTs. (July 2016) Authors: Baghaie Yazdi, M.; Schmeidl, M.; Wu, X.; Neyer, T. Journal: Microelectronics and reliability Issue: Volume 62(2016) Page Start: 74 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
55. A cost-effective repair scheme for clustered TSV defects in 3D ICs. (February 2022) Authors: Maity, Dilip Kumar; Roy, Surajit Kumar; Giri, Chandan Journal: Microelectronics and reliability Issue: Volume 129(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
56. A cost-efficient error-resilient approach to distributed arithmetic for signal processing. (February 2019) Authors: Lu, Yue; Duan, Shengyu; Halak, Basel; J Kazmierski, Tom Journal: Microelectronics and reliability Issue: Volume 93(2019) Page Start: 16 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
57. A critical analysis of the bulk current injection immunity test based on common-mode and differential-mode. (December 2018) Authors: Tan, Ligang; Li, Ziwen; Xiang, Yunxiu; Feng, Pengfei; Guo, Yage Journal: Microelectronics and reliability Issue: Volume 91(2018)Part 2 Page Start: 188 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
58. A cross layer approach for efficient thermal management in 3D stacked SoCs. (June 2016) Authors: Jung, Matthias; Weis, Christian; Wehn, Norbert Journal: Microelectronics and reliability Issue: Volume 61(2016) Page Start: 43 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
59. A cross-layer aging-aware task scheduling approach for multiprocessor embedded systems. (June 2018) Authors: Karami, Masoomeh; Abdi, Athena; Zarandi, Hamid R. Journal: Microelectronics and reliability Issue: Volume 85(2018) Page Start: 190 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
60. A cross-layer SER analysis in the presence of PVTA variations. Issue 7 (June 2015) Authors: Farahani, Bahar; Habibi, Seyedamin; Safari, Saeed Journal: Microelectronics and reliability Issue: Volume 55:Issue 7(2015) Page Start: 1013 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗