A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. (August 2018)

• Record Type: Journal Article
• Authors: Niu, Yuling; Wang, Jing; Shao, Shuai; Wang, Huayan; Lee, Hohyung; Park, S.B.
• Is Part Of: Microelectronics and reliability. Volume 87(2018)
• Page Start: 81
• Page End: 88
• Publication Date: 2018-08
• Subjects: Digital image correlation -- Electronic package -- Reliability assessment -- Warpage; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.06.006
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The reliability assessment of electronic packages demands more accurate and efficient method for evaluating heterogeneous packages and their interconnects in various measurement conditions. The digital image correlation (DIC) method has been fully developed in the last decade. With proper improvement, this work demonstrates that DIC method has the ability to fulfill various experimental tasks and obtain the information for interconnect strain analysis, coefficient of thermal expansion (CTE) characterization, in-plane displacement and out-of-plane warpage quantification within one measurement. To some extent, it serves as a comprehensive tool for electronic packages' reliability assessment. Given that the DIC technique is new to the electronic packaging area, this work illustrates the principle of optical non-contact experiment method and presents several improvements to fit for the measurement on electronic packaging area. With these applications, it is foreseeable that the DIC method will play an important role in the reliability assessment of electronic packages. Highlights: This work provides various DIC applications to assess the electronics reliability. Single sensor DIC learns local strain and dual sensors report global deformation. Dual views and stereoscopic DIC (4 sensors) methods were developed. High-speed DIC method for impact test was presented.