3591. Wide Bandgap Materials for Semiconductor Devices. (December 2018) Authors: Lee, Kuan-Wei; Liu, Chuan-Hsi; Misra, Durga Journal: Microelectronics and reliability Issue: Volume 91(2018)Part 2 Page Start: 306 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3592. Wire bond degradation under thermo- and pure mechanical loading. (September 2017) Authors: Pedersen, Kristian Bonderup; Nielsen, Dennis A.; Czerny, Bernhard; Khatibi, Golta; Iannuzzo, Francesco; Popok, Vladimir N.; Pedersen, Kjeld Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 373 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3593. Wire width dependence of hot carrier degradation in silicon nanowire gate-all-around MOSFETs. Issue 9 (August 2015) Authors: Choi, Jin Hyung; Park, Jong Tae Journal: Microelectronics and reliability Issue: Volume 55:Issue 9/10(2015) Page Start: 1438 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3594. Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules. (November 2020) Authors: Nazar, M.; Ibrahim, A.; Khatir, Z.; Degrenne, N.; Al-Masry, Z. Journal: Microelectronics and reliability Issue: Volume 114(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3595. Wireless sEMG-based identification in a virtual reality environment. (July 2019) Authors: Li, Xiaoou; Zhou, Zhiyong; Liu, Wanyang; Ji, Mengjie Journal: Microelectronics and reliability Issue: Volume 98(2019) Page Start: 78 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3596. Workload and temperature dependent evaluation of BTI-induced lifetime degradation in digital circuits. Issue 8 (July 2015) Authors: Eghbalkhah, Behzad; Kamal, Mehdi; Afzali-Kusha, Hassan; Afzali-Kusha, Ali; Ghaznavi-Ghoushchi, Mohammad Bagher; Pedram, Massoud Journal: Microelectronics and reliability Issue: Volume 55:Issue 8(2015) Page Start: 1152 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3597. X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm. (December 2016) Authors: Shen, Junjie; Chen, Pengfei; Su, Lei; Shi, Tielin; Tang, Zirong; Liao, Guanglan Journal: Microelectronics and reliability Issue: Volume 67(2016) Page Start: 129 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3598. XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. (September 2017) Authors: Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 390 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3599. Young's modulus of a sintered Cu joint and its influence on thermal stress. (September 2017) Authors: Ishizaki, T.; Miura, D.; Kuno, A.; Hasegawa, K.; Usui, M.; Yamada, Y. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 405 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3600. Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities. (June 2018) Authors: McWilliam, Richard; Khan, Samir; Farnsworth, Michael; Bell, Colin Journal: Microelectronics and reliability Issue: Volume 85(2018) Page Start: 122 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗