Young's modulus of a sintered Cu joint and its influence on thermal stress. (September 2017)

• Record Type: Journal Article
• Authors: Ishizaki, T.; Miura, D.; Kuno, A.; Hasegawa, K.; Usui, M.; Yamada, Y.
• Is Part Of: Microelectronics and reliability. Volume 76/77(2017)
• Page Start: 405
• Page End: 408
• Publication Date: 2017-09
• Subjects: Sintering -- Joint -- Cu nanoparticle -- Young's modulus -- Power cycle; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.06.015
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Al2 O3 chips and pure Cu plates were joined by Cu nanoparticles at 250 °C and 350 °C, and the Young's moduli of the sintered Cu were evaluated by nanoindentation tests. The average Young's moduli were 52.7 ± 19.8 GPa and 76.5 ± 29.7 GPa at 250 °C and 350 °C, respectively, indicating that the sintered structures were strengthened at higher temperatures. The calculation results indicated that the joint at 350 °C has a high Young's modulus, but make the stress higher than the chip strength, resulting in breakage of the chip during 65/250 °C power cycling. Highlights: Young's modulus of a sintered Cu joint was studied by nanoindentation test. Higher Young's modulus was obtained as sintering temperature increased. The relationship between porosities and Young's moduli was studied. The calculation showed that the joint chip was broken as Young's modulus increased.