3581. Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging. (January 2018) Authors: Chiu, Tz-Cheng; Yeh, En-Yu Journal: Microelectronics and reliability Issue: Volume 80(2018) Page Start: 14 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3582. Water cold plates for high power converters: A software tool for easy optimized design. (September 2018) Authors: Cova, P.; Delmonte, N.; Chiozzi, D.; Portesine, M.; Vaccaro, F.; Mantegazza, E. Journal: Microelectronics and reliability Issue: Volume 88/90(2018) Page Start: 801 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3583. Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation. (September 2019) Authors: Jiang, Maogong; Fu, Guicui; Fogsgaard, Martin Bendix; Bahman, Amir Sajjad; Yang, Yongheng; Iannuzzo, Francesco Journal: Microelectronics and reliability Issue: Volume 100/101(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3584. Wear-out failure analysis of modular multilevel converter-based STATCOM: The role of the modulation strategy and IGBT blocking voltage. (January 2022) Authors: de Sousa, R.O.; Cupertino, A.F.; Morais, L.M.F.; Pereira, H.A. Journal: Microelectronics and reliability Issue: Volume 128(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3585. Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices. (November 2020) Authors: Vernica, I.; Choi, U.M.; Wang, H.; Blaabjerg, F. Journal: Microelectronics and reliability Issue: Volume 114(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3586. Wettable flank routable thin MicroLeadFrame for automotive applications. (August 2022) Authors: Kim, Byong Jin; Jeon, HyeongIl; Kim, GiJeong; Cho, Nam-Hee; Khim, JinYoung; Kim, Yeong K. Journal: Microelectronics and reliability Issue: Volume 135(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3587. Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders. (July 2019) Authors: Lin, Qiaoli; Ye, Changsheng; Sui, Ran; Ci, Wenjuan Journal: Microelectronics and reliability Issue: Volume 98(2019) Page Start: 112 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3588. Wetting of monocrystalline silicon (100) surface by Sn0.3Ag0.7Cu-xTi (x = 1 and 3 wt%) alloys at 800–900 °C. (January 2020) Authors: Wang, Jianbin; Lin, Qiaoli; Li, Hui; Mu, Dekui Journal: Microelectronics and reliability Issue: Volume 104(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3589. Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders. (August 2020) Authors: Lin, Qiaoli; Ye, Changsheng; Sui, Ran Journal: Microelectronics and reliability Issue: Volume 111(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3590. What is Electrical Overstress? - Analysis and Conclusions. Issue 6 (May 2015) Authors: Kaschani, K.T. Journal: Microelectronics and reliability Issue: Volume 55:Issue 6(2015) Page Start: 853 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗