261. Specification for letter symbols for semiconductor devices and integrated microcircuits. (28th November 1980) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (32 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
262. Specification for letter symbols for semiconductor devices and integrated microcircuits. (30th January 1981) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (12 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
263. Specification for letter symbols for semiconductor devices and integrated microcircuits. (31st December 1980) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (18 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
264. Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method Part 3-1, (31st October 2022) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (30 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
265. Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering Part 3, (18th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (34 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
266. Surface mounting technology. Standard method for the specification of surface mounting components (SMDs) Part 1, (2nd October 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (50 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
267. Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide Part 2, (10th September 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (22 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
268. Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide Part 2, (15th June 1998) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
269. Testing of interposer-based 2.5D integrated circuits. (2017) Authors: Wang, Ran; Chakrabarty, Krishnendu Record Type: Book Extent: 1 online resource (xiv, 182 pages), illustrations (some color) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
270. The everything blueprint : processing power, politics, and the microchip design that conquered the world /: processing power, politics, and the microchip design that conquered the world. (2023) Authors: (Journalist), Ashton, James Record Type: Book Extent: 1 online resource (400 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗