Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method Part 3-1, (31st October 2022)

Record Type:
Book
Title:
Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method Part 3-1, (31st October 2022)
Main Title:
Surface mounting technology.
Authors:
British Standards Institution,
Issue Display:
Part 3
Part:
3
Issue Sort Value:
0000-0000-0000-0003
Publisher Details:
London : British Standards Institution
Publication Date:
2022
Extent:
1 online resource (30 pages)
Subjects:
602.1841
Components
Electrical components
Circuits
Integrated circuits
Surface mounting devices
Solders
Languages:
English
Related ISBNs:
9780539179361
ISSNs:
3043-8361
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.718876
Ingest File:
14_036.xml