Journal: Journal of micromechanics and microengineering - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Journal of micromechanics and microengineering

1. 10–25 GHz frequency reconfigurable MEMS 5-bit phase shifter using push–pull actuator based toggle mechanism. (15th May 2015)

Authors:: Dey, Sukomal; Koul, Shiban K
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 25:Number 6(2015:Jun.)
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Record Type:: Journal Article
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2. 2D FPCB micromirror for scanning LIDAR. (1st December 2023)

Authors:: Tai, Trevor S; He, Siyuan; Ghazinouri, Behrad
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 33:Number 12(2023)
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Record Type:: Journal Article
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3. 2D segmented large inkjet printhead for high speed 3D printers. (7th April 2015)

Authors:: Einat, Moshe; Bar-Levav, Elkana
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 25:Number 5(2015:May)
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Record Type:: Journal Article
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4. 2D stepping drive for hyperspectral systems. (22nd May 2015)

Authors:: Endrödy, Csaba; Mehner, Hannes; Grewe, Adrian; Sinzinger, Stefan; Hoffmann, Martin
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 25:Number 7(2015:Jul.)
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Record Type:: Journal Article
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5. 3C-SiC microdisk mechanical resonators with multimode resonances at radio frequencies. (6th June 2017)

Authors:: Lee, Jaesung; Zamani, Hamidrera; Rajgopal, Srihari; Zorman, Christian A; Feng, Philip X-L
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 27:Number 7(2017:Jul.)
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Record Type:: Journal Article
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6. 3D assembly of carbon nanotubes for fabrication of field-effect transistors through nanomanipulation and electron-beam-induced deposition. (12th September 2017)

Authors:: Yu, Ning; Shi, Qing; Nakajima, Masahiro; Wang, Huaping; Yang, Zhan; Sun, Lining; Huang, Qiang; Fukuda, Toshio
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 27:Number 10(2017:Oct.)
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Record Type:: Journal Article
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7. 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing. (7th March 2017)

Authors:: Le, Fuliang; Lee, Shi-Wei Ricky; Zhang, Qiming
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 27:Number 4(2017:Apr.)
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Record Type:: Journal Article
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8. 3D electroplated inductors with thickness variation for improved broadband performance. (25th October 2016)

Authors:: Tseng, Victor Farm-Guoo; Bedair, Sarah S; Lazarus, Nathan
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 27:Number 1(2017:Jan.)
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Record Type:: Journal Article
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9. 3D filling simulation of micro- and nanostructures in comparison to iso- and variothermal injection moulding trials. (12th May 2016)

Authors:: Rytka, C; Lungershausen, J; Kristiansen, P M; Neyer, A
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 26:Number 6(2016:Jun.)
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Record Type:: Journal Article
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10. 3D lithium ion battery fabrication via scalable stacked multilayer electrodeposition. (25th March 2019)

Authors:: Synodis, Michael J; Kim, Minsoo; Allen, Mark G; Allen, Sue Ann Bidstrup
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 29:Number 5(2019:May)
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Record Type:: Journal Article
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