Is Part Of: Microelectronics and reliability. Volume 92(2019) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 92(2019)

1. Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission. (January 2019)

Authors:: Beyreuther, A.; Vogt, I.; Herfurth, N.; Nakamura, T.; Fischer, G.G.; Motamedi, B.; Boit, C.
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 143
Record Type:: Journal Article
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2. Editorial Board. (January 2019)

Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: ii
Record Type:: Journal Article
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3. Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect. (January 2019)

Authors:: Zhu, Ze; Chan, Yan-cheong; Wu, Fengshun
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 12
Record Type:: Journal Article
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4. Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface. (January 2019)

Authors:: Oh, Gyung-Hwan; Joo, Sung-Jun; Jeong, Jae-Woo; Kim, Hak-Sung
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 63
Record Type:: Journal Article
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5. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. (January 2019)

Authors:: Bettahi, Yousra; Richard, Caroline
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 20
Record Type:: Journal Article
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6. Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration. (January 2019)

Authors:: Wu, Yuelin; Barton, Scott Calabrese; Lee, Andre
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 79
Record Type:: Journal Article
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7. High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method. (January 2019)

Authors:: Mitsuta, Hiroki; Sakai, Kaoru
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 172
Record Type:: Journal Article
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8. Metallized film capacitors used for EMI filtering: A reliability review. (January 2019)

Authors:: Valentine, Nathan; Azarian, Michael H.; Pecht, Michael
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 123
Record Type:: Journal Article
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9. Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation. (January 2019)

Authors:: Herfurth, N.; Wu, C.; Beyreuther, A.; Nakamura, T.; De Wolf, I.; Simon-Najasek, M.; Altmann, F.; Croes, K.; Boit, C.
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 73
Record Type:: Journal Article
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10. On the cumulative distribution function of the defect centric model for BTI reliability. (January 2019)

Authors:: Nouguier, D.; Pananakakis, G.; Federspiel, X.; Rafik, M.; Roy, D.; Ghibaudo, G.
Journal:: Microelectronics and reliability
Issue:: Volume 92(2019)
Page Start:: 168
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗