Is Part Of: Microelectronics and reliability. Volume 86(2018) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 86(2018)

1. Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. (July 2018)

Authors:: Wlanis, Thomas; Hammer, René; Ecker, Werner; Lhostis, Sandrine; Sart, Clément; Gallois-Garreignot, Sébastien; Rebhan, Bernhard; Maier, Günther A.
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 1
Record Type:: Journal Article
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2. Editorial Board. (July 2018)

Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: ii
Record Type:: Journal Article
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3. Effect of potting materials on LED bulb's driver temperature. (July 2018)

Authors:: Nguyen, Nam; Dinh, Van-Quyen; Nguyen-Duc, Tung; Ta, Quoc-Tuan; Dao, Xuan-Viet; Pham, Thanh-Huy; Nguyen-Duc, Trung-Kien
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 77
Record Type:: Journal Article
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4. Electro thermal modeling of the power diode using Pspice. (July 2018)

Authors:: Hanini, Wasma; Ayadi, Moez
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 82
Record Type:: Journal Article
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5. Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate. (July 2018)

Authors:: Mikkonen, Riikka; Mäntysalo, Matti
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 54
Record Type:: Journal Article
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6. Experimental identification of LED compact thermal model element values. (July 2018)

Authors:: Janicki, Marcin; Torzewicz, Tomasz; Samson, Agnieszka; Raszkowski, Tomasz; Napieralski, Andrzej
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 20
Record Type:: Journal Article
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7. Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement. (July 2018)

Authors:: Krištofík, Štefan; Baláž, Marcel; Malík, Peter
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 38
Record Type:: Journal Article
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8. Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model. (July 2018)

Authors:: Raszkowski, Tomasz; Samson, Agnieszka; Zubert, Mariusz
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 10
Record Type:: Journal Article
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9. Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics. (July 2018)

Authors:: Choi, Kyeonggon; Yu, Dong-Youl; Ahn, Sungdo; Kim, Kyoung-Ho; Bang, Jung-Hwan; Ko, Yong-Ho
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 66
Record Type:: Journal Article
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10. Opcode vector: An efficient scheme to detect soft errors in instructions. (July 2018)

Authors:: Martinez, Jorge; Atamaner, Mert; Reviriego, Pedro; Ergin, Oguz; Ottavi, Marco
Journal:: Microelectronics and reliability
Issue:: Volume 86(2018)
Page Start:: 92
Record Type:: Journal Article
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