Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate. (July 2018)

• Record Type: Journal Article
• Authors: Mikkonen, Riikka; Mäntysalo, Matti
• Is Part Of: Microelectronics and reliability. Volume 86(2018)
• Page Start: 54
• Page End: 65
• Publication Date: 2018-07
• Subjects: Printed electronics -- PPE -- Surface modification -- Adhesion -- Environmental stress -- Reliability; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.05.010
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Otherwise attractive substrate materials for printed electronics may have such surface characteristics that make patterning challenging. This article focuses on the printability and performance characterization of conductive patterns on a low surface energy substrate. Surface characteristics of a hydrophobic polyphenylene ether (PPE) substrate and the effects of surface modification using chemical and physical pre-treatments were studied. In addition, silver ink performance and its reliability on this substrate were evaluated. The surface was characterized by surface energy measurements and surface profile analysis. Screen-printed test patterns were characterized to evaluate print quality and electrical and mechanical performance. A further inspection of substrate-ink interactions was conducted using environmental reliability tests. It was observed that ink adhesion could be significantly promoted by choosing a suitable surface pre-treatment method. Low sheet resistances were obtained, and thus, suitable inks for further characterization were found. In addition, it was observed that environmental stress has a significant impact on ink-substrate interactions. Highlights: Wetting and roughness modification of hydrophobic polyphenylene ether substrate. Silver ink characterization on native and modified polyphenylene ether substrates. Substrate surface characteristics impact on adhesion significant. Enhanced interface reliability in harsh environment by substrate surface treatments.