Is Part Of: Microelectronics and reliability. Volume 74(2017) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 74(2017)

1. A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs. (July 2017)

Authors:: Azarifar, Mohammad; Donmezer, Nazli
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 82
Record Type:: Journal Article
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2. A prognostic method for predicting failure of dc/dc converter. (July 2017)

Authors:: Qingchuan, He; Wenhua, Chen; Jun, Pan; Ping, Qian
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 27
Record Type:: Journal Article
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3. Book review. (July 2017)

Authors:: Gan, Chong Leong; Moideen, Mohammad Zainudeen
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 81
Record Type:: Journal Article
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4. Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs. (July 2017)

Authors:: Dai, Lihua; Liu, Xiaonian; Zhang, Mengying; Zhang, Leqing; Hu, Zhiyuan; Bi, Dawei; Zhang, Zhengxuan; Zou, Shichang
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 74
Record Type:: Journal Article
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5. Editorial Board. (July 2017)

Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: IFC
Record Type:: Journal Article
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6. Effect of roughness on electrical contact performance of electronic components. (July 2017)

Authors:: Liu, Xin-long; Cai, Zhen-bing; Liu, Shan-bang; Peng, Jin-fang; Zhu, Min-hao
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 100
Record Type:: Journal Article
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7. Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. (July 2017)

Authors:: Ghosh, Rituparna; Kanjilal, Anwesha; Kumar, Praveen
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 44
Record Type:: Journal Article
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8. Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder. (July 2017)

Authors:: Huang, Huizhen; Shuai, Gewang; Wei, Xiuqin; Yin, Chuanqiang
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 15
Record Type:: Journal Article
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9. Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling. (July 2017)

Authors:: Qiu, Delong; Cao, Liqiang; Wang, Qidong; Hou, Fengze; Wang, Xugang
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 34
Record Type:: Journal Article
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10. Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. (July 2017)

Authors:: Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert
Journal:: Microelectronics and reliability
Issue:: Volume 74(2017)
Page Start:: 131
Record Type:: Journal Article
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