Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs. (July 2017)
- Record Type:
- Journal Article
- Title:
- Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs. (July 2017)
- Main Title:
- Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs
- Authors:
- Dai, Lihua
Liu, Xiaonian
Zhang, Mengying
Zhang, Leqing
Hu, Zhiyuan
Bi, Dawei
Zhang, Zhengxuan
Zou, Shichang - Abstract:
- Abstract: Hot-carrier reliability for devices operating in radiation environment must be considered. In this paper, we investigate how total ionizing dose impacts the hot-carrier reliability of partially-depleted SOI I/O NMOSFETs, highlighting the effect of buried oxide. Firstly, radiation-induced damage on short channel SOI devices with 100 nm thick Si film was investigated. After low total dose irradiation, incomplete fully-depleted state has been formed due to the non-uniformly distributed positive charges in the buried oxide. Furthermore, as the dominated factor of hot-carrier injection, the body current reduces after irradiation. Subsequently, the irradiated SOI devices were subjected to hot-carrier stress for 9000-s long time. Compared with unirradiated devices, the irradiated samples display enhanced hot-carrier degradation. We attribute this phenomenon to that radiation lowers the barrier for hot-carrier injection. Therefore, in order to ensure the reliability of SOI devices operating in harsh radiation environments, SOI devices with higher quality or corresponding hardness design should be taken. Highlights: After hot-carrier stress the irradiated devices display an enhanced degradation as compared to the unirradiated samples. Radiation lowers the barrier for hot-carrier-injection during hot-carrier stress. After irradiation the incomplete fully-depleted state has been formed due to the trapped positive charges in BOX. The body current reduces after irradiation.
- Is Part Of:
- Microelectronics and reliability. Volume 74(2017)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 74(2017)
- Issue Display:
- Volume 74, Issue 2017 (2017)
- Year:
- 2017
- Volume:
- 74
- Issue:
- 2017
- Issue Sort Value:
- 2017-0074-2017-0000
- Page Start:
- 74
- Page End:
- 80
- Publication Date:
- 2017-07
- Subjects:
- Partially-depleted SOI -- Total ionizing dose -- Hot-carrier degradation -- Buried oxide
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2017.05.021 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 805.xml