Is Part Of: Microelectronics and reliability. Volume 71(2017) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 71(2017)

1. Editorial Board. (April 2017)

Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: IFC
Record Type:: Journal Article
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2. Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. (April 2017)

Authors:: Yoon, Hyungseok; Choi, Kwang-Seong; Bae, Hyun-Cheol; Moon, Jong-Tae; Eom, Yong-Sung; Jeon, Insu
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 41
Record Type:: Journal Article
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3. Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. (April 2017)

Authors:: Liang, S.B.; Ke, C.B.; Ma, W.J.; Zhou, M.B.; Zhang, X.P.
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 71
Record Type:: Journal Article
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4. High-current stressing of organic light-emitting diodes with different electron-transport materials. (April 2017)

Authors:: Liu, L.; Li, S.; Zhou, Y.M.; Liu, L.Y.; Cao, X.A.
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 106
Record Type:: Journal Article
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5. Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing. (April 2017)

Authors:: Chen, Yilong; Jia, Jianyuan; Fu, Hongzhi; Zhu, Zhaofei
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 134
Record Type:: Journal Article
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6. Improved on-chip self-triggered single-event transient measurement circuit design and applications. (April 2017)

Authors:: Chen, Rongmei; Chen, Wei; Guo, Xiaoqiang; Shen, Chen; Zhang, Fengqi; Zheng, Lisang; Zhao, Wen; Ding, Lili; Luo, Yinhong; Guo, Hongxia; Wang, Yuanming; Liu, Yinong
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 99
Record Type:: Journal Article
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7. Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock. (April 2017)

Authors:: Tan, Shihai; Han, Jing; Guo, Fu
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 126
Record Type:: Journal Article
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8. Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC. (April 2017)

Authors:: Tran, Hiep; Kracica, Masturina; McCulloch, Dougal; Mayes, Edwin; Holland, Anthony; Partridge, James
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 82
Record Type:: Journal Article
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9. Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory. (April 2017)

Authors:: Shokravi, M.
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 17
Record Type:: Journal Article
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10. Single event effects sensitivity of low energy proton in Xilinx Zynq-7010 system-on chip. (April 2017)

Authors:: Du, Xuecheng; Liu, Shuhuan; Luo, Dongyang; Zhang, Yao; Du, Xiaozhi; He, Chaohui; Ren, Xiaotang; Yang, Weitao; Yuan, Yuan
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 65
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗