Is Part Of: Microelectronics and reliability. Volume 55:Issue 9/10(2015) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 55:Issue 9/10(2015)

1. 16-Channel micro magnetic flux sensor array for IGBT current distribution measurement. Issue 9 (August 2015)

Authors:: Tomonaga, H.; Tsukuda, M.; Okoda, S.; Noda, R.; Tashiro, K.; Omura, I.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1357
Record Type:: Journal Article
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2. 3D simulation of single-event-transient effects in symmetrical dual-material double-gate MOSFETs. Issue 9 (August 2015)

Authors:: Munteanu, D.; Autran, J.L.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1522
Record Type:: Journal Article
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3. A distributed minority and majority voting based redundancy scheme. Issue 9 (August 2015)

Authors:: Balasubramanian, P.; Maskell, D.L.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1373
Record Type:: Journal Article
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4. A methodologic project to characterize and model COTS component reliability. Issue 9 (August 2015)

Authors:: Durier, A.; Bensoussan, A.; Zerarka, M.; Ghfiri, C.; Boyer, A.; Frémont, H.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 2097
Record Type:: Journal Article
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5. A novel analytical method for defect tolerance assessment. Issue 9 (August 2015)

Authors:: Slimani, M.; Ben Dhia, A.; Naviner, L.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1285
Record Type:: Journal Article
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6. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Issue 9 (August 2015)

Authors:: Cui, Zaifu; Cai, Miao; Li, Ruifeng; Zhang, Ping; Chen, Xianping; Yang, Daoguo
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1877
Record Type:: Journal Article
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7. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Issue 9 (August 2015)

Authors:: Cui, Zaifu; Cai, Miao; Li, Ruifeng; Zhang, Ping; Chen, Xianping; Yang, Daoguo
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1877
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

8. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Issue 9 (August 2015)

Authors:: Cui, Zaifu; Cai, Miao; Li, Ruifeng; Zhang, Ping; Chen, Xianping; Yang, Daoguo
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1877
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

9. A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. Issue 9 (August 2015)

Authors:: Sauveplane, J.B.; Retho, P.; Venet, N.; Buso, D.; Perez, G.; Lefrileux, J.S.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1815
Record Type:: Journal Article
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10. A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design. Issue 9 (August 2015)

Authors:: Cavaiuolo, D.; Riccio, M.; Maresca, L.; Irace, A.; Breglio, G.; Daprà, D.; Sanfilippo, C.; Merlin, L.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1971
Record Type:: Journal Article
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