A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design. Issue 9 (August 2015)

• Record Type: Journal Article
• Authors: Cavaiuolo, D.; Riccio, M.; Maresca, L.; Irace, A.; Breglio, G.; Daprà, D.; Sanfilippo, C.; Merlin, L.
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 9/10(2015)
• Page Start: 1971
• Page End: 1975
• Publication Date: 2015-08
• Subjects: IGBT -- SPICE model -- Electro-thermal -- Short-circuit; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.06.086
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: An optimized electro-thermal IGBT SPICE model based on the Kraus model was developed to allow reliable simulation at application level. A particular emphasis to the temperature dependence of physical parameters was given for both the on-state and breakdown conditions. The model was experimentally validated in steady state and transient operation on a Field-Stop trench-gate 30 A–600 V commercial IGBT device. The effectiveness of the convergence–accuracy aspects was proved for the proposed model. The application to the short-circuit protection circuit design for a hard switched fault in an inverter motor-drive application was also analysed. The ability of the proposed IGBT model was experimentally verified with a simplified-equivalent circuit where a short condition was forced on the load, enabling the desaturation protection by the IGBT driver. The results show an accurate prediction of the device electro-thermal behaviour under short-circuit conditions, with a possible optimal design of the desaturation circuit parameters when the device experiences hard-switched-fault or fault-under-load events.