Is Part Of: Microelectronics and reliability. Volume 55:Issue 6(2015) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 55:Issue 6(2015)

1. Analysis of dielectric breakdown in CoFeB/MgO/CoFeB magnetic tunnel junction. Issue 6 (May 2015)

Authors:: Khan, Ayaz Arif
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 894
Record Type:: Journal Article
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2. Assessing the value of a lead-free solder control plan using cost-based FMEA. Issue 6 (May 2015)

Authors:: Lillie, Edwin; Sandborn, Peter; Humphrey, David
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 969
Record Type:: Journal Article
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3. Design, development and reliability testing of a low power bridge-type micromachined hotplate. Issue 6 (May 2015)

Authors:: Prasad, Mahanth
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 937
Record Type:: Journal Article
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4. Enhanced power cycling performance of IGBT modules with a reinforced emitter contact. Issue 6 (May 2015)

Authors:: Özkol, Emre; Brem, Franziska; Liu, Chunlei; Hartmann, Samuel; Kopta, Arnost
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 912
Record Type:: Journal Article
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5. Impact of substrate resistance and layout on passivation etch-induced wafer arcing and reliability. Issue 6 (May 2015)

Authors:: Li, Po; Wang, Yung-Cheng; Peng, Jing-Wei; Zhang, David Wei
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 931
Record Type:: Journal Article
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6. Inside front cover - Editorial board. Issue 6 (May 2015)

Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: IFC
Record Type:: Journal Article
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7. Low cost and highly reliable radiation hardened latch design in 65 nm CMOS technology. Issue 6 (May 2015)

Authors:: Qi, Chunhua; Xiao, Liyi; Guo, Jing; Wang, Tianqi
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 863
Record Type:: Journal Article
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8. Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions. Issue 6 (May 2015)

Authors:: Mirgkizoudi, M.; Liu, C.; Conway, P.P.; Riches, S.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 952
Record Type:: Journal Article
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9. Microstructural evolution of ultrasonic-bonded aluminum wires. Issue 6 (May 2015)

Authors:: Broll, Marian Sebastian; Geissler, Ute; Höfer, Jan; Schmitz, Stefan; Wittler, Olaf; Lang, Klaus Dieter
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 961
Record Type:: Journal Article
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10. Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer. Issue 6 (May 2015)

Authors:: Zhou, M.; Zhang, B.C.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 879
Record Type:: Journal Article
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