Is Part Of: Materials science in semiconductor processing. Volume 148(2022) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Materials science in semiconductor processing. Volume 148(2022)

1. A numerical study of the effect of pulse duration on preventing particle generation during the AlN pulsed MOCVD process. (September 2022)

Authors:: Lin, Wei-Jie; Chen, Jyh-Chen
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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Record Type:: Journal Article
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2. A review on recent advances of chemical vapor deposition technique for monolayer transition metal dichalcogenides (MX2: Mo, W; S, Se, Te). (September 2022)

Authors:: Aras, F. Gonca; Yilmaz, Alp; Tasdelen, H. Gunalp; Ozden, Ayberk; Ay, Feridun; Perkgoz, Nihan Kosku; Yeltik, Aydan
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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Record Type:: Journal Article
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3. An effective Ni/C co-catalyst for promoting photocatalytic hydrogen evolution over TiO2 nanospheres. (September 2022)

Authors:: Zhao, Xueying; Xie, Wenyu; Shao, Xueqing; Wang, Zhuan; Yang, Bo; Yang, Chao; Wang, Jide; Su, Xintai
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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4. Analysis of the electrical activation data in thermally annealed implanted Al/4H–SiC systems: A novel approach based on cooperativity. (September 2022)

Authors:: Boldrini, Virginia; Parisini, Antonella; Pieruccini, Marco
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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5. Biaxial strain tuned electronic structure, lattice thermal conductivity and thermoelectric properties of MgI2 monolayer. (September 2022)

Authors:: Tao, Wang-Li; Lan, Jun-Qing; Hu, Cui-E; Chen, Xiang-Rong; Geng, Hua-Yun
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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Record Type:: Journal Article
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6. Bismuth-containing semiconductors GaAs1−xBix for energy conversion: Thermoelectric properties. (September 2022)

Authors:: Reshak, A.H.
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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7. Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced micro/nanostructures. (September 2022)

Authors:: Cao, Peilin; Wang, Cong; Lin, Nai; Li, Shaohui; Zhang, Xiaofeng; Duan, Ji'an
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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8. Chemical stoichiometry effect of hafnium oxide (HfOx) for passivation layer of PERC solar cells. (September 2022)

Authors:: Kim, Jaeun; Ju, Minkyu; Kim, Youngkuk; Yi, Junsin
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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9. Compositional, electrical and thermal properties of nonstoichiometric titanium oxide thin films for MEMS bolometer applications. (September 2022)

Authors:: Yadav, Isha; Jain, Surbhi; Joshi, Shalik Ram; Goyal, Anshu; Tomar, Monika; Gupta, Sudha; Dutta, Shankar; Chatterjee, Ratnamala
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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10. Crack damage control for diamond wire sawing of silicon: The selection of processing parameters. (September 2022)

Authors:: Ge, Mengran; Chen, Zibin; Wang, Peizhi; Ge, Peiqi
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
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Record Type:: Journal Article
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