Journal: Microelectronics and reliability / Issue: Volume 57(2016) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Journal Microelectronics and reliability Issue Volume 57(2016)

11. Impact of on- and off-chip protection on the transient-induced latch-up sensitivity of CMOS IC. (February 2016)

Authors:: Scholz, Mirko; Chen, Shih-Hung; Hellings, Geert; Linten, Dimitri
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 53
Record Type:: Journal Article
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12. Improved inductive-system-level IEC ESD performance for automotive applications using mutual ballasted ESD protection technique. (February 2016)

Authors:: Salman, Akram A.; Farbiz, Farzan; Concannon, Ann; Edwards, Hal; Boselli, Gianluca
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 47
Record Type:: Journal Article
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13. Improved performance of ITO/TiO2/HfO2/Pt random resistive accessory memory by nitrogen annealing treatment. (February 2016)

Authors:: Deng, Tengfei; Ye, Cong; Wu, Jiaji; He, Pin; Wang, Hao
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 34
Record Type:: Journal Article
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14. Lifetime estimation of LED lamp using gamma process model. (February 2016)

Authors:: Park, Sung Ho; Kim, Jae Hoon
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 71
Record Type:: Journal Article
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15. Study of gate leakage mechanism in advanced charge-coupled MOSFET (CC-MOSFET) technology. (February 2016)

Authors:: Barletta, G.; Ngwan, V.C.
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 20
Record Type:: Journal Article
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16. Temperature dependent Young's modulus and quality factor of CMOS-MEMS resonator: Modelling and experimental approach. (February 2016)

Authors:: Jan, Mohammad Tariq; Ahmad, Farooq; Hamid, Nor Hisham B.; Md Khir, Mohd Haris B.; Ashraf, Khalid; Shoaib, Muhammad
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 64
Record Type:: Journal Article
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17. Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive. (February 2016)

Authors:: Yim, Byung-Seung; Kim, Jong-Min
Journal:: Microelectronics and reliability
Issue:: Volume 57(2016)
Page Start:: 93
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗