1. 1T-NOR Flash memory after endurance degradation: An advanced TCAD simulation. (November 2022) Authors: Matteo, F.; Simola, R.; Postel-Pellerin, J.; Coulié, K. Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A combined modelling approach to design test structures to study thermomigration in Cu interconnects. (November 2022) Authors: Ding, Y.; Lofrano, M.; Varela Pedreira, O.; Zahedmanesh, H.; Croes, K.; De Wolf, I. Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. A comparative radiation analysis of reconfigurable memory technologies: FinFET versus bulk CMOS. (November 2022) Authors: Azimi, S.; De Sio, C.; Portaluri, A.; Rizzieri, D.; Sterpone, L. Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. A data-driven method for anomaly detection and aging model parameter estimation of capacitors based on condition monitoring. (November 2022) Authors: Lv, Chunlin; Liu, Jinjun; Zhang, Yan Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. A data-driven photovoltaic string current mismatch fault diagnosis method based on I-V curve. (November 2022) Authors: Zhang, Zhixiang; Ma, Mingyao; Ma, Wenting; Zhang, Rui; Wang, Jun Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. A fast decomposition algorithm of positive and negative sequence components with sampling noise optimization. (November 2022) Authors: Ma, Mingyao; Liang, Jiacheng; Xiang, Nianwen; Wang, Hanyu; Wu, Jijun Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. A novel methodology to characterize LGA packaged GaN power transistors using a mother/daughter board configuration for the reliability qualification in the mild hybrid applications. (November 2022) Authors: Douzi, Chawki; Kadi, Moncef; Dherbecourt, Pascal; Besserour, Mohamed Akram; Joubert, Eric; Fouquet, François Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. A novel nanoprobing analysis flow by using multi-probe configuration to localize silicide defect in MOSFET. (November 2022) Authors: Zheng, Shijun; Yang, Jianli; Tian, Li; Che, Yi; Zhai, Lin Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. A temperature-insensitive process corner detection circuit based on self-timing ring oscillator. (November 2022) Authors: Yang, Lixin; Li, Dejian; Yang, Xiaokun; Feng, Xi; Tan, Lang; Shen, Chongfei; Cai, Hao Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. A thermal network model for monitoring IGBT chip solder degradation based on feedback PI control. (November 2022) Authors: Zhang, Xiaotong; Mu, Wei; Lv, Chunlin; Shi, Miao; Yu, Xiaoling; Wu, Kangning; Li, Jianying Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗