1. A 3-D Integrated Common Mode Filter Based on Through Silicon vias Technology. Issue 1 (1st November 2022) Authors: Wang, Fengjuan; Huang, Haoxiang; Yin, Xiangkun; Yu, Ningmei; Yang, Yuan Journal: Journal of physics Issue: Volume 2370: Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A Compact Reflectionless Low-Pass Filter Based on TSV Technology. Issue 1 (1st November 2022) Authors: Wang, Fengjuan; Wang, Rui; Li, Ruiqi; Yu, Ningmei; Yang, Yuan Journal: Journal of physics Issue: Volume 2370: Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. A hexagonal high-performance transformer balun based on TSV technology for W-band application. Issue 1 (1st December 2022) Authors: Wang, Fengjuan; Zhang, Dingxi; Yu, Ningmei; Yang, Yuan Journal: Journal of physics Issue: Volume 2405 Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. A self-compensated approach for ramp kickback noise in CMOS image sensor column parallel single slope ADC. (February 2022) Authors: Guo, Zhongjie; Yu, Ningmei; Wu, Longsheng Journal: Microelectronics journal Issue: Volume 120(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. A soft decoding algorithm and hardware implementation for the visual prosthesis based on high order soft demodulation. Issue 1 (December 2016) Authors: Yang, Yuan; Quan, Nannan; Bu, Jingjing; Li, Xueping; Yu, Ningmei Journal: Biomedical engineering online Issue: Volume 15:Issue 1(2016) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. A TSV-Based Helical Dual-Band Antenna. Issue 1 (1st January 2023) Authors: Wang, Fengjuan; Ren, Jiashuo; Yu, Ningmei; Yang, Yuan Journal: Journal of physics Issue: Volume 2419:Issue 1(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. An S‐ to Ku‐wideband low‐noise amplifier using asymmetric π filter and shunt‐peaking technique with simultaneous input match and noise flatness. Issue 6 (10th March 2019) Authors: Jing, Kai; Yu, Ningmei; Quan, Xing Journal: Microwave and optical technology letters Issue: Volume 61:Issue 6(2019:Jun.) Page Start: 1509 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Column readout circuit with improved offset mismatch and charge sharing for CMOS image sensor. (December 2019) Authors: Guo, Zhongjie; Yu, Ningmei; Wu, Longsheng Journal: Journal of semiconductors Issue: Volume 40:Number 12(2019:Dec.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Compact high-performance dual-frequency power divider based on TSV. (November 2022) Authors: Wang, Fengjuan; Li, Ruiqi; Yin, Xiangkun; Yu, Ningmei; Yang, Yuan Journal: Microelectronics journal Issue: Volume 129(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Diode triggered ESD power clamp circuit with accurate discharge duration. Issue 11 (1st May 2016) Authors: Yang, Zhaonian; Zhang, Yue; Yang, Yuan; Yu, Ningmei Journal: Electronics letters Issue: Volume 52:Issue 11(2016) Page Start: 949 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗