A TSV-Based Helical Dual-Band Antenna. Issue 1 (1st January 2023)

• Record Type: Journal Article
• Authors: Wang, Fengjuan; Ren, Jiashuo; Yu, Ningmei; Yang, Yuan
• Is Part Of: Journal of physics. Volume 2419:Issue 1(2023)
• Publication Date: 2023-01-01
• Subjects: Physics -- Congresses; 530.5
• DOI: 10.1088/1742-6596/2419/1/012029
• Languages: English
• ISSNs: 1742-6588

Abstract

Abstract: This paper come up with a novel helical dual-band antenna that can be used in terahertz (THz) band applications. The antenna is fed by a redistribution layer (RDL), and the metal patch is formed on the top and bottom surfaces of the silicon dielectric substrate, which is connected by through-silicon via (TSV) to form a helical structure. At the same time, better impedance matching can be achieved by changing the shape of the ground plate to achieve dual-band characteristics. The simulation results presentation that the return loss of the antenna in 319GHz-339GHz and 373GHz-388GHz is less than -10db, and it has good axial radiation characteristics.