1. Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper. (2017) Authors: Maruya, Yuki; Hata, Hanae; Shohji, Ikuo; Koyama, Shinji Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 223 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Change of Crystallographic Orientation Characteristics of (001)-Oriented Electrodeposited Silver Films During Self-Annealing at Room Temperature. (2017) Authors: Hayashi, Yumi; Shohji, Ikuo; Koyama, Shinji; Miyazawa, Hiroshi Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 725 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens. (13th June 2018) Authors: Kobayashi, Tatsuya; Kobayashi, Kyosuke; Mitsui, Kohei; Shohji, Ikuo Other Names: Smaga Marek Academic Editor. Journal: Advances in materials science and engineering Issue: Volume 2018(2018) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and persistence of reformed layer. (19th January 2015) Authors: Koyama, Shinji; Hagiwara, Naoki; Shohji, Ikuo Journal: Japanese journal of applied physics Issue: Volume 54:Number 3(2015:Mar.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper Under Aging at High Temperature. (2017) Authors: Tonozuka, Yu; Shohji, Ikuo; Koyama, Shinji; Hokazono, Hiroaki Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 648 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding under High Temperature and Humidity Conditions. (2017) Authors: Tomita, Yugo; Shohji, Ikuo; Koyama, Shinji; Shimizu, Seigo Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 231 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCs. (2017) Authors: Hayashi, Yawara; Nakata, Yusuke; Shohji, Ikuo; Koyama, Shinji; Hashimoto, Tomihito Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 214 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints. (9th May 2018) Authors: Kobayashi, Tatsuya; Shohji, Ikuo; Nakata, Yusuke Other Names: De Jesus Abílio Academic Editor. Journal: Advances in materials science and engineering Issue: Volume 2018(2018) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper. (2017) Authors: Higuchi, Kazunari; Shohji, Ikuo; Ando, Tetsuya; Koyama, Shinji; Mizutani, Yoshikazu; Inoue, Yukio Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 743 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions. (2017) Authors: Kobayashi, Kyosuke; Shohji, Ikuo; Koyama, Shinji; Hokazono, Hiroaki Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 238 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗