1. An extensive survey on finger and palm vein recognition system. (2021) Authors: Adiraju, Rama Vasantha; Masanipalli, Kranthi Kumar; Reddy, Tamalampudi Deepak; Pedapalli, Rohini; Chundru, Sindhu; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 45:Part 2(2021) Page Start: 1804 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. An extensive survey on reduction of noise coupling in TSV based 3D IC integration. (2021) Authors: Pragathi, Dadaipally; Prasad, Dumpa; Padma, Tatiparti; Rahul Reddy, P.; Usha Kumari, Ch.; Kumar Poola, Praveen; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 45:Part 2(2021) Page Start: 1471 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Design of approximate reverse carry select adder using RCPA. Issue 2 (3rd April 2023) Authors: Turaka, Rajasekhar; Bonagiri, Koteswara Rao; Rao, Talla Srinivasa; Kumar, Gundugonti Kishore; Jayabalan, Sudharsan; Sreenivasulu, V. Bharath; Panigrahy, Asisa Kumar; Prakash, M. Durga Journal: International journal of electronics letters Issue: Volume 11:Issue 2(2023) Page Start: 146 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Design of area-efficient high speed 4 × 4 Wallace tree multiplier using quantum-dot cellular automata. (2021) Authors: Arunkumar Gudivada, A.; Jayaram Kumar, K.; Jajula, Srinivasa Rao; Siddani, Durga Prasad; Poola, Praveen Kumar; Vourganti, Varun; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 45:Part 2(2021) Page Start: 1514 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. ICT System for 14.0 Adoption: Comparative Study to Assess the Readiness in Manufacturing MSMEs. (11th August 2022) Authors: Nandhini, S.; Palanivelu, V. R.; Panigrahy, Asisa Kumar; Vignesh, N. Arun; Kasirajan, Ramachandran Other Names: Chelladurai Samson Jerold Samuel Academic Editor. Journal: Journal of nanomaterials Issue: Volume 2022(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. ICT System for 14.0 Adoption: Comparative Study to Assess the Readiness in Manufacturing MSMEs. (11th August 2022) Authors: Nandhini, S.; Palanivelu, V. R.; Panigrahy, Asisa Kumar; Vignesh, N. Arun; Kasirajan, Ramachandran Other Names: Chelladurai Samson Jerold Samuel Academic Editor. Journal: Journal of nanomaterials Issue: Volume 2022(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Noise performance improvement in 3D IC integration utilizing different dielectric materials. (2020) Authors: Pragathi, Dadaipally; Rakesh, Banothu; Kumar, P. Sriram; Vignesh, N. Arun; Padma, Tatiparti; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 33:Part 7(2020) Page Start: 3117 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Silicon Wearable Body Area Antenna for Speech-Enhanced IoT and Nanomedical Applications. (23rd May 2022) Authors: Vignesh, N. Arun; Kumar, Ravi; Rajarajan, R.; Kanithan, S.; Kumar, E. Sathish; Panigrahy, Asisa Kumar; Periyasamy, Selvakumar Other Names: Chelladurai Samson Jerold Samuel Academic Editor. Journal: Journal of nanomaterials Issue: Volume 2022(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Simplistic approach to alleviate noise coupling issues in 3D IC integration. (2020) Authors: Pragathi, Dadaipally; Kumari, Ch Usha; Rani, M. Usha; Kumar, T. Santosh; Padma, Tatiparti; Kumar, P. Sriram; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 33:Part 7(2020) Page Start: 4007 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Simplistic approach to reduce thermal issues in 3D IC integration technology. (2021) Authors: Rakesh, Banothu; Prasad, Dumpa; Kumari, Ch. Usha; Vighnesh, N. Arun; Suresh, M.; Panigrahy, Asisa Kumar Journal: Materials today Issue: Volume 45:Part 2(2021) Page Start: 1399 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗