1. Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology. Issue 1 (1st January 2019) Authors: Menk, L. A.; Josell, D.; Moffat, T. P.; Baca, E.; Blain, M. G.; Smith, A.; Dominguez, J.; McClain, J.; Yeh, P. D.; Hollowell, A. E. Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3066 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology. Issue 1 (2nd November 2018) Authors: Menk, L. A.; Josell, D.; Moffat, T. P.; Baca, E.; Blain, M. G.; Smith, A.; Dominguez, J.; McClain, J.; Yeh, P. D.; Hollowell, A. E. Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3066 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs. Issue 1 (13th December 2018) Authors: Menk, L. A.; Baca, E.; Blain, M. G.; McClain, J.; Dominguez, J.; Smith, A.; Hollowell, A. E. Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3226 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs. Issue 1 (1st January 2019) Authors: Menk, L. A.; Baca, E.; Blain, M. G.; McClain, J.; Dominguez, J.; Smith, A.; Hollowell, A. E. Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3226 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗