Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs. Issue 1 (13th December 2018)

• Record Type: Journal Article
• Authors: Menk, L. A.; Baca, E.; Blain, M. G.; McClain, J.; Dominguez, J.; Smith, A.; Hollowell, A. E.
• Is Part Of: Journal of the Electrochemical Society. Volume 166:Issue 1(2019)
• Page Start: D3226
• Page End: D3231
• Publication Date: 2018-12-13
• Subjects: Electrodeposition - Copper -- MEMs -- Microelectronics - Semiconductor Processing -- 3D Interconnects -- Through Silicon Vias -- TSV; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0271901jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : A methanesulfonic acid (MSA) electrolyte with a single suppressor additive was used for potentiostatic bottom-up filling of copper in mesoscale through silicon vias (TSVs). Conversly, galvanostatic deposition is desirable for production level full wafer plating tools as they are typically not equipped with reference electrodes which are required for potentiostatic plating. Potentiostatic deposition was used to determine the over-potential required for bottom-up TSV filling and the resultant current was measured to establish a range of current densities to investigate for galvanostatic deposition. Galvanostatic plating conditions were then optimized to achieve void-free bottom-up filling in mesoscale TSVs for a range of sample sizes.