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You searched for: Author/Creator Liu, Huilong

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1. A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging. (10th November 2022)

2. A phase I study of FCN-411, a pan-HER inhibitor, in EGFR-mutated advanced NSCLC after progression on EGFR tyrosine kinase inhibitors. (April 2022)

3. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning. (25th May 2021)

5. Anisotropic Charge Transport Enabling High‐Throughput and High‐Aspect‐Ratio Wet Etching of Silicon Carbide (Small Methods 8/2022). Issue 8 (17th August 2022)