1. An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures. (1st April 2018) Authors: Kim, Youngsoo; Kim, Yongtae; Lee, Tae-Ik; Kim, Taek-Soo; Ryu, Seunghwa Journal: Composite structures Issue: Volume 189(2018) Page Start: 27 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Contact-free thermal expansion measurement of very soft elastomers using digital image correlation. (May 2016) Authors: Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo Journal: Polymer testing Issue: Volume 51(2016:May) Page Start: 181 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Contact-free thermal expansion measurement of very soft elastomers using digital image correlation. (May 2016) Authors: Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo Journal: Polymer testing Issue: Volume 51(2016:May) Page Start: 181 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates. (15th September 2017) Authors: Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo Journal: Composite structures Issue: Volume 176(2017) Page Start: 973 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature. (March 2022) Authors: Jo, Woosung; Lee, Tae-Ik; Kim, Taek-Soo Journal: Microelectronics and reliability Issue: Volume 130(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics. Issue 10 (5th January 2017) Authors: Seo, Ji-Won; Joo, Munkyu; Ahn, Jaeho; Lee, Tae-Ik; Kim, Taek-Soo; Im, Sung Gap; Lee, Jung-Yong Journal: Nanoscale Issue: Volume 9:Issue 10(2017) Page Start: 3399 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Flexural and tensile moduli of flexible FR4 substrates. (August 2016) Authors: Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo Journal: Polymer testing Issue: Volume 53(2016:Aug.) Page Start: 70 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Flexural and tensile moduli of flexible FR4 substrates. (August 2016) Authors: Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo Journal: Polymer testing Issue: Volume 53(2016:Aug.) Page Start: 70 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing. (June 2017) Authors: Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo Journal: Microelectronics and reliability Issue: Volume 73(2017) Page Start: 136 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module. (November 2022) Authors: Kim, Dongjin; Lee, Byeongsoo; Lee, Tae-Ik; Noh, Seungjun; Choe, Chanyang; Park, Semin; Kim, Min-Su Journal: Microelectronics and reliability Issue: Volume 138(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗