Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature. (March 2022)
- Record Type:
- Journal Article
- Title:
- Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature. (March 2022)
- Main Title:
- Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature
- Authors:
- Jo, Woosung
Lee, Tae-Ik
Kim, Taek-Soo - Abstract:
- Abstract: Understanding the mechanical strain imposed on flexible electronics during bending is an essential consideration for the robust design of devices. In general, the bending behavior of flexible electronics is analyzed such that the cross-sectional mechanical strain distribution is the same along the width direction. However, even though a single curvature is applied to the cross section, the anticlastic curvature occurs along the width owing to the Poisson's ratio effect along the width. In this study, we analyze the effect of the anticlastic curvature on the maximum tensile strain of a flexible substrate because it is critical to the fracture of brittle films on the substrate. The strain distributions at the center and edge of a bent 75 μm-thick polyethylene terephthalate (PET) substrate are measured using the microscale digital image correlation (DIC) method. The anticlastic curvature effect on the maximum tensile strain of the bent substrate is analyzed through a three-dimensional finite element method (FEM) simulation. Results of DIC analysis and FEM simulation show that the maximum tensile strain at the edge of the substrate is larger than that at the center of the substrate owing to the anticlastic curvature. The enlarged tensile strain at the edge of a flexible substrate is experimentally validated by bending a laser patterned hard-coated PET substrate. Highlights: The tensile strain along the width of PET substrate under bending is studied. The maximumAbstract: Understanding the mechanical strain imposed on flexible electronics during bending is an essential consideration for the robust design of devices. In general, the bending behavior of flexible electronics is analyzed such that the cross-sectional mechanical strain distribution is the same along the width direction. However, even though a single curvature is applied to the cross section, the anticlastic curvature occurs along the width owing to the Poisson's ratio effect along the width. In this study, we analyze the effect of the anticlastic curvature on the maximum tensile strain of a flexible substrate because it is critical to the fracture of brittle films on the substrate. The strain distributions at the center and edge of a bent 75 μm-thick polyethylene terephthalate (PET) substrate are measured using the microscale digital image correlation (DIC) method. The anticlastic curvature effect on the maximum tensile strain of the bent substrate is analyzed through a three-dimensional finite element method (FEM) simulation. Results of DIC analysis and FEM simulation show that the maximum tensile strain at the edge of the substrate is larger than that at the center of the substrate owing to the anticlastic curvature. The enlarged tensile strain at the edge of a flexible substrate is experimentally validated by bending a laser patterned hard-coated PET substrate. Highlights: The tensile strain along the width of PET substrate under bending is studied. The maximum tensile strain at edge of PET is larger than that at center of PET. The strain difference is attributed to the anticlastic curvature occurrence at edge. Enlarged maximum tensile strain at edge is experimentally validated by DIC analysis. … (more)
- Is Part Of:
- Microelectronics and reliability. Volume 130(2022)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 130(2022)
- Issue Display:
- Volume 130, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 130
- Issue:
- 2022
- Issue Sort Value:
- 2022-0130-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-03
- Subjects:
- Anticlastic curvature -- Neutral plane -- Digital image correlation -- Mechanical reliability -- Flexible electronics
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2022.114485 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
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