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Author/Creator Lee, Su Yeon

1. 3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020). (4th November 2020)

Authors:
Jo, Yejin; Park, Hye Jin; Kim, Young‐Bin; Lee, Sun Sook; Lee, Su Yeon; Kim, Sun‐Kyung; Choi, Youngmin; Jeong, Sunho
Journal:
Advanced functional materials
Issue:
Volume 30:Number 45(2020)
Page Start:
n/a
Record Type:
Journal Article
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3. 3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers. Issue 16 (9th February 2017)

Authors:
Jo, Yejin; Kim, Ju Young; Kim, So-Yun; Seo, Yeong-Hui; Jang, Kwang-Suk; Lee, Su Yeon; Jung, Sungmook; Ryu, Beyong-Hwan; Kim, Hyun-Suk; Park, Jang-Ung; Choi, Youngmin; Jeong, Sunho
Journal:
Nanoscale
Issue:
Volume 9:Issue 16(2017)
Page Start:
5072
Record Type:
Journal Article
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7. A Surface Conformal Laser‐Assisted Alloying Reaction for 3D‐Printable Solid/Liquid Biphasic Conductors. Issue 3 (3rd February 2023)

Authors:
Shim, Jiyun; Kim, Yeon Uk; Kim, Young-Bin; Ji, Seul Gi; Kim, Yeon Ju; Jo, Yejin; Lee, Eun Jung; Yuk, Do-Gyeong; Lee, Su Yeon; Lee, Sun Sook; Kim, Sun-Kyung; Kim, Hyung-Seok; Park, Jung Hwan; Jeong, Sunho
Journal:
Small science
Issue:
Volume 3:Issue 3(2023)
Page Start:
n/a
Record Type:
Journal Article
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