1. Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect. (1st January 2017) Authors: Van Nguyen, Son; Hosadugra, Shobha; Haigh, T.; Yao, Y.; Tai, L.; Cohen, S.; Shaw, T.; Hu, C. K.; Liniger, E.; Virwani, K.; Kellock, A. J.; Canaperi, D. Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 7(2017) Page Start: P429 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect. (25th May 2017) Authors: Van Nguyen, Son; Hosadugra, Shobha; Haigh, T.; Yao, Y.; Tai, L.; Cohen, S.; Shaw, T.; Hu, C. K.; Liniger, E.; Virwani, K.; Kellock, A. J.; Canaperi, D. Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 7(2017) Page Start: P429 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗