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You searched for: Author/Creator Jo, Yejin

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1. 3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020). (4th November 2020)

4. 3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers. Issue 16 (9th February 2017)

6. A Surface Conformal Laser‐Assisted Alloying Reaction for 3D‐Printable Solid/Liquid Biphasic Conductors. Issue 3 (3rd February 2023)

8. Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles1. Issue 9 (4th March 2015)