1. A methodologic project to characterize and model COTS component reliability. Issue 9 (August 2015) Authors: Durier, A.; Bensoussan, A.; Zerarka, M.; Ghfiri, C.; Boyer, A.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 55:Issue 9/10(2015) Page Start: 2097 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Characterization and model of temperature effect on the conducted immunity of Op-Amp. Issue 9 (August 2015) Authors: Dubois, T.; Hairoud, S.; Gomes de Oliveira, M.H.; Frémont, H.; Duchamp, G. Journal: Microelectronics and reliability Issue: Volume 55:Issue 9/10(2015) Page Start: 2055 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. (September 2017) Authors: Pin, S.; Frémont, H.; Guédon-Gracia, A. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 368 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. (September 2018) Authors: Pin, S.; Guédon-Gracia, A.; Delétage, J.-Y.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 88/90(2018) Page Start: 1172 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Dynamical IMC-growth calculation. Issue 9 (August 2015) Authors: Meinshausen, L.; Weide-Zaage, K.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 55:Issue 9/10(2015) Page Start: 1832 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability. (November 2020) Authors: Arabi, F.; Gracia, A.; Delétage, J.-Y.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 114(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach. (September 2017) Authors: Hairoud-Airieau, S.; Duchamp, G.; Dubois, T.; Delétage, J.-Y.; Durier, A.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 674 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Effects of salt spray test on lead-free solder alloy. (September 2016) Authors: Guédon-Gracia, A.; Frémont, H.; Plano, B.; Delétage, J.-Y.; Weide-Zaage, K. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 242 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Effects of salt spray test on lead-free solder alloy. (September 2016) Authors: Guédon-Gracia, A.; Frémont, H.; Plano, B.; Delétage, J.-Y.; Weide-Zaage, K. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 242 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Issue 1 (January 2015) Authors: Meinshausen, L.; Frémont, H.; Weide-Zaage, K.; Plano, Bernard Journal: Microelectronics and reliability Issue: Volume 55:Issue 1(2015) Page Start: 192 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗