1. Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers. (June 2019) Authors: Abadie, K.; Montméat, P.; Enot, T.; Fournel, F.; Wimplinger, M. Journal: International journal of adhesion & adhesives Issue: Volume 91(2019) Page Start: 123 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Development and adhesion characterization of a silicon wafer for temporary bonding. (April 2018) Authors: Montméat, P.; Enot, T.; Enyedi, G.; Pellat, M.; Thooris, J.; Fournel, F. Journal: International journal of adhesion & adhesives Issue: Volume 82(2018) Page Start: 100 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Direct Bonding Mechanism of ALD-Al2O3 Thin Films. (1st January 2015) Authors: Beche, E.; Fournel, F.; Larrey, V.; Rieutord, F.; Morales, C.; Charvet, A.-M; Madeira, F.; Audoit, G.; Fabbri, J.-M. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 5(2015) Page Start: P171 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Direct Bonding Mechanism of ALD-Al2O3 Thin Films. (25th March 2015) Authors: Beche, E.; Fournel, F.; Larrey, V.; Rieutord, F.; Morales, C.; Charvet, A.-M; Madeira, F.; Audoit, G.; Fabbri, J.-M. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 5(2015) Page Start: P171 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. (15th May 2015) Authors: Schjølberg-Henriksen, K.; Malik, N.; Gundersen, E. V.; Christiansen, O. R.; Imenes, K.; Fournel, F.; Moe, S. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 7(2015) Page Start: P265 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. (1st January 2015) Authors: Schjølberg-Henriksen, K.; Malik, N.; Gundersen, E. V.; Christiansen, O. R.; Imenes, K.; Fournel, F.; Moe, S. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 7(2015) Page Start: P265 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Gripwise® versus Jamar®: the challenge of devices assessing handgrip strength for sarcopenia diagnosis in older inpatients with cancer. (October 2022) Authors: Sebag, P.; Villain, C.; Lebaube, S.; Kremer, C.; Chavoix, C.; Fournel, F.; Briant, A.; Beauplet, B. Journal: Journal of geriatric oncology Issue: Volume 13(2022)Supplement 1 Page Start: S39 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Impact of Amino-Alcohol Organic Molecule on Various Silicon Oxide Bondings. (16th June 2021) Authors: Calvez, A.; Fournel, F.; Larrey, V.; Eleouet, G.; Morales, C.; Rieutord, F. Journal: ECS journal of solid state science and technology Issue: Volume 10:Number 6(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Impact of the temperature process on the morphology of 3D temporary bonded wafers: Quantification and reducing of the effect. (December 2021) Authors: Montméat, P.; Le Cocq, M.; Enot, T.; Zussy, M.; Fournel, F. Journal: Materials science in semiconductor processing Issue: Volume 136(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process. (1st March 2021) Authors: Montméat, P.; Bally, L.; Dechamp, J.; Enot, T.; Fournel, F. Journal: Materials science in semiconductor processing Issue: Volume 123(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗