Impact of Amino-Alcohol Organic Molecule on Various Silicon Oxide Bondings. (16th June 2021)

• Record Type: Journal Article
• Authors: Calvez, A.; Fournel, F.; Larrey, V.; Eleouet, G.; Morales, C.; Rieutord, F.
• Is Part Of: ECS journal of solid state science and technology. Volume 10:Number 6(2021)
• Publication Date: 2021-06-16
• Subjects: Solid state chemistry -- Periodicals; Electronics -- Materials -- Periodicals; Electrochemistry -- Periodicals; 541.0421
• DOI: 10.1149/2162-8777/ac08d7
• Languages: English
• ISSNs: 2162-8777

Abstract

Abstract : Recently a new surface preparation method using an organic molecule was introduced for silicon direct wafer bonding F. Fournel, L. Continni, C. Morales, J. Da Fonseca, H. Moriceau, F. Rieutord, A. Barthelemy, and I. Radu, J. Appl. Phys., 111, 104907 (2012). Adding a very small amount of amino-alcohol molecule at the bonding interface drastically increased the bonding energy after low post bonding annealing temperature. In this study, additional developments using the same molecule type (DEAE: N-N-diethylaminoethanol) are presented.