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Author/Creator De Vos, Joeri

1. 57‐3: MircoLED Display Integration on 300mm Advanced CMOS Platform. Issue 1 (28th June 2022)

Authors:
Steudel, Soeren; Vertommen, Johan; Le Boulbar, Emmanuel; Buscemi, Giuseppe; Bach, Lars; Van Huylenbroeck, Stefaan; Arumugam, Hariharan; La Tulipe, Douglas Charles; De Vos, Joeri; Miller, Andy; Osman, Haris; Rebibis, Kenneth June
Journal:
Digest of technical papers
Issue:
Volume 53:Issue 1(2022)
Page Start:
748
Record Type:
Journal Article
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2. Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices. (17th April 2015)

Authors:
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof
Journal:
Japanese journal of applied physics
Issue:
Volume 54:Number 5(2015:May)Supplement
Page Start:
Record Type:
Journal Article
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3. Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. (December 2017)

Authors:
Ključar, Luka; González, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Bömmels, Jürgen; Beyne, Eric; Tőkei, Zsolt
Journal:
Microelectronics and reliability
Issue:
Volume 79(2017)
Page Start:
297
Record Type:
Journal Article
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Available online (eLD content is only available in our Reading Rooms) ↗