Author/Creator: Brandelero, J. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Brandelero, J.

1. Effect of post bonding annealing on the reliability of Al based wire bondings in IGBTs. (November 2022)

Authors:: Karanja, L.; Pichon, P.; Brandelero, J.; Legros, M.
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
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Record Type:: Journal Article
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2. Effects of solder degradation on the die temperature measurement via internal gate resistance. (November 2020)

Authors:: Kawahara, C.; Brandelero, J.; Pichon, P.; Mollov, S.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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3. Impact of heat treatment on the lifetime of wire-bonded power modules. (November 2021)

Authors:: Brandelero, J.; Pichon, P.; Legros, M.
Journal:: Microelectronics and reliability
Issue:: Volume 126(2021)
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Record Type:: Journal Article
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4. Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module. (September 2018)

Authors:: Brandelero, J.; Ewanchuk, J.; Degrenne, N.; Mollov, S.
Journal:: Microelectronics and reliability
Issue:: Volume 88/90(2018)
Page Start:: 428
Record Type:: Journal Article
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5. Relative importance of solder and wire bond defects on the maximum junction temperature of IGBT devices. (November 2021)

Authors:: Pichon, P.-Y.; Brandelero, J.
Journal:: Microelectronics and reliability
Issue:: Volume 126(2021)
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Record Type:: Journal Article
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